About

Manufacture semiconductor IC packages, hybrid modules and microelectronic products. Thick film Technology was also introduced in October 2001 to further enhance capabilities and meet growing market and customer needs. Tong Hsing Electronics (Phils), Inc. is one of the leading IC hybrid assembly houses specializing on Chip Scale Package (CSP), Land Grid Array (LGA) packages, Quad Flat No Leads (QFN), Dual Flat No Leads (DFN), High Reliability Products, and other devices such as PCB assembly with Surface Mount Technology (SMT) and Chip On Board (COB) processes, Multi Chip Modules especially on RF Modules, Image Sensors and Thick Film Assembly. The company also specializes in Direct Plated Copper (DPC) Ceramic Substrates. Cleanroom environment ranges from class 10, class 100, class 10K and class 100K.m class 10, class 100, class 10K and class 100K

Service Offerings

Contact

info@net.tonghsing.ph

www.tonghsing.ph

(63-49) 549-4250 / 549-4252

Primary Location