About

Power Device (semi-conductor) manufacturing employing basic operations/process that include wafer chip singulation and inspection chip (die) and aluminum wire attachments, plastic molding with epoxy resin, deflashing, unit singulation, lead soldering & tin plating for MP2, electrical characteristics testing, final inspection, packing and shipment of finished products. Approximately using one hundred seventy two (172) different kinds of machines such as Wafer Saw, Die Bonder, Wire Bonder, Molding Machine, Deflashing Machine, Cutting, Solder Dipping, Isolation Testing Machine, Tin Plating, Drying and Test Handler.

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